(4,19mm) .165" ipbt series ipbt?105?h1?t?s?ra?gp ipbt?110?h1?t?d?ra ipbt?105?h1?t?d?gp optional polarized guide post holes latching mechanism for mating with ipbd series individually shrouded pins (4,19mm) .165" pitch www.samtec.com no. of positions x (4,19) .165 + (12,27) .483 no. of positions x (4,19) .165 + (6,10) .240 (3,30) .130 15 30 01 02 16 01 02 16 15 30 no. of positions x (4,19) .165 + (1,33) .0525 (3,43) .135 dia (1,52) .060 (3,73) .147 (6,58) .259 (4,19) .165 (5,21) .205 (9,60) .378 (1,14) .045 sq (3,73) .147 (1,52) .060 (5,51) .217 (11,40) .450 a (11,43) .450 (15,62) .615 (1,27) .050 (10,77) .424 (4,06) .160 (10,29) .405 (6,58) .259 f-210 for complete speci cations see www.samtec.com?ipbt insulator material: black liquid crystal polymer contact material: high copper alloy plating: sn over 50? (1,27?) ni operating temp range: -40? to +105? rohs compliant: ye s processing: max processing temp: 230? for 60 seconds, or 260? for 20 seconds 3x lead?free solderable: ye s no. of positions per row 1 02, 03, 04, 05, 08, 10, 15 (?d only) 02, 03, 04, 05 (?s only) (call samtec for other sizes) ipbt row option plating option ?t = matte tin note: some lengths, styles and options are non-standard, non-returnable. lead style ?h1 = through-hole ?h2 = surface mount ?hx = elevated through-hole (specify ?xx? from chart ?d only) option mates with: ipbs, ipbd, pmsd, pmss, scr1 ? gp option ?s = single row ?d = double row ? h2?s ? h1?s?ra ? h2?d ? h1?d?ra ? h1?s ? h3?d lead style a (12,07) .475 (14,05) .553 (15,04) .592 (20,05) .789 ?h3 ?h4 ?h5 ?h6 ? h1?d application ipbt mated height ipbs ?ra = right angle (lead style ?h1 only) ?gp = guide post holes (8 positions not available) specifications ambient temp 20c 40c 60c 75c current rating ipbt/ipbs 11.3a 10a 8a 6.7a 6 positions (2x3) powered isolated terminal power header ?h1/?01 ?h2/?02 ?h3/?01 ?h4/?01 ?h5/?01 ?h6/?01 ipbt/ipbs lead style (15,25) .600 (16,84) .663 (17,00) .670 (19,00) .748 (20,00) .789 (25,00) .984 mated height* *processing conditions will affect mated height.
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